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Microinterconnect Solutions

Flexible Circuits

Display applications are increasing in functionality while IC driver size is shrinking. 3M's leading-edge technology enables reliable Chip on Flex interconnection of the driver IC to 3M™ Flexible Circuits, as well as interconnection to the display glass and a printed circuit board. 3M circuits can be folded flat, saving valuable space. 3M's plants in Singapore and the US ensure a multiple source of supply. 3M is also exploring custom circuit designs for hinge, camera and antenna applications.

Mobile Microinterconnects Solutions features
  • Leading-edge fine pitch capability
  • 1-metal layer and 2-metal layer construction
  • 35 micron pitch at volume production levels for 1-metal layer (2-metal layer down to 60µ pitch)
  • 30 micron pitch for prototypes for 1-metal layer (2-metal layer down to 50µ pitch)
  • Maximum flexibility (can be folded flat)
  • Additive plating for square lead cross-section, enabling a robust COF interconnection
  • Varying trace copper thickness (4µ - 36µ)
  • Nickel/Gold and Tin plating
  • 25µ, 38µ
  • or 50µ, polyimide thicknesses
  • Flexible overcoat materials
  • Screened or photoimaged overcoat
  • Connector stiffener option
  • High volume, global manufacturing locations
Demo and Sample Requests

3M™ Flexible Circuits are ideal for LCD-TFT and LCD module COF applications used in computers (notebook displays and desktop monitors), consumer products (mobile phones, PDAs, and gaming devices), TFT & plasma TV, automotive and aircraft cockpit displays.

With a bend radius of 180 degrees, ultra-thin 3M™ Flexible Circuits can fit into your small device configurations, helping reduce both product size and weight.




PDFMultilayer Flex Design Rules PDF 15.0K