Skip to Primary Navigation Skip to Site Navigation Skip to Main Content All 3M.com Site Map

Microinterconnect Solutions

Flexible Circuits

Display applications are increasing in functionality while IC driver size is shrinking. 3M's leading-edge technology enables reliable Chip on Flex interconnection of the driver IC to 3M™ Flexible Circuits, as well as interconnection to the display glass and a printed circuit board. 3M circuits can be folded flat, saving valuable space. 3M's plants in Singapore and the US ensure a multiple source of supply. 3M is also exploring custom circuit designs for hinge, camera and antenna applications.

Mobile Microinterconnects Solutions features
  • Leading-edge fine pitch capability
  • 1-metal layer and 2-metal layer construction
  • 35 micron pitch at volume production levels for 1-metal layer (2-metal layer down to 60µ pitch)
  • 30 micron pitch for prototypes for 1-metal layer (2-metal layer down to 50µ pitch)
  • Maximum flexibility (can be folded flat)
  • Additive plating for square lead cross-section, enabling a robust COF interconnection
  • Varying trace copper thickness (4µ - 36µ)
  • Nickel/Gold and Tin plating
  • 25µ, 38µ
  • or 50µ, polyimide thicknesses
  • Flexible overcoat materials
  • Screened or photoimaged overcoat
  • Connector stiffener option
  • High volume, global manufacturing locations
Demo and Sample Requests

3M™ Flexible Circuits are ideal for LCD-TFT and LCD module COF applications used in computers (notebook displays and desktop monitors), consumer products (mobile phones, PDAs, and gaming devices), TFT & plasma TV, automotive and aircraft cockpit displays.

With a bend radius of 180 degrees, ultra-thin 3M™ Flexible Circuits can fit into your small device configurations, helping reduce both product size and weight.

SpecificationsApplicationsManufacturing

PDF PDF 22.2K

PDF PDF 29.1K

PDFMultilayer Flex Design Rules PDF 15.0K