3M uses cookies on this site Detailed information on cookies and their use can be found in our Privacy Policy. You can customize the cookie-related settings at any time by clicking on Cookie Preferences in the footer of this page.

By clicking "Accept and Proceed" you acknowledge that you agree to the use of cookies on your computer

Accept and Proceed

Skip to Primary Navigation Skip to Site Navigation Skip to Main Content All 3M.com Site Map

3M™ CMP Solutions

Our next-generation abrasive technologies give you more production-proven ways to help meet today's most demanding CMP requirements. With pad conditioners for conventional slurry processes and unique fixed abrasives, our products deliver superior planarization, a more stable process and low defect rates.

CMP Solutions Product Families

3M™ SlurryFree™ Fixed Abrasives

3M™ Fixed Abrasives

The proven, high performance alternative to conventional slurries, pads and conditioners lets you polish thousands of wafers between consumable changes.

Pad Conditioning

Pad Conditioners

Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protrusion to produce a consistent finish, with superior diamond retention to reduce scratching.