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Wafer Thinning

3M™ Wafer Support System

The new 3M™ Wafer Support System uses a unique, UV-curable 3M adhesive to bond wafers to a support surface that minimizes stress on the wafer as silicon is removed. The system includes all the equipment and consumables necessary for mounting, demounting and removing adhesive from the wafer.



Product Applications/Notes
3M™ UV-Curable Adhesive LC-3200 3M™ Liquid UV-Curable Adhesive LC-3200 is a 100% solids UV curable acrylic adhesive. Adhesive LC-3200 is suitable for mounting silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System.
3M™ UV-Curable Adhesive LC-4200 3M™ Liquid UV-Curable Adhesive LC-4200 is a 100% solids UV curable acrylic adhesive. Adhesive LC-4200 is suitable for mounting silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System. Adhesive LC-4200 has been designed to allow for post processing of mounted wafers at temperatures up to 180°C for extended periods as well as short excursions to 200°C.
3M™ Light-To-Heat-Conversion (LTHC) Coating 3M™ Light-To-Heat-Conversion (LTHC) Release Coating is a solvent-based coating. This coating forms the light to heat conversion layer on glass using the substrate for 3M™ Wafer Support System by spin coating method.
3M™ Wafer De-Taping Tape 3305 3M™ Wafer De-Taping Tape 3305 is a transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.