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Sondhi™ Rapid-Set Indirect Bonding Adhesive

Sondhi™ Rapid-Set Indirect Bonding Adhesive is a lightly filled resin which cures in half the time (2 minutes vs. 4 minutes) of other indirect adhesives,1 while achieving two thirds of its bond strength within the first five minutes.1


Designed to complement our APC™ Adhesive Coated Appliances, the Sondhi rapid-set indirect bonding adhesive provides the benefits of indirect bonding. More accurate bracket placement; less bracket repositioning; maximisation of orthodontists time; and compared to direct bonding, decreased chair time and patient discomfort from simultaneous bonding of all brackets.

Designed to complement our APC™ Adhesive Coated Appliances, the Sondhi rapid-set indirect bonding adhesive allows you to take full advantage of the benefits of indirect bonding with more accurate bracket placement.

With better control over bracket placement and a high level of precision, accuracy and strength, Sondhi Rapid-Set Indirect Bonding Adhesive aims to deliver an efficient experience, for the orthodontist and the patient.


  1. 3M Unitek data on file, 3M Unitek Claim DB Centre “Sondhi (TM) Pre-Mix Chemical Cure Adhesive when used at room temperature of 74 degrees F (23 degrees C) sets in 80-120 seconds.”, Claim Number: 2010 - S10413

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