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Sondhi™ Rapid-Set Indirect Bonding Adhesive

Sondhi™ Rapid-Set Indirect Bonding Adhesive is a lightly filled resin which cures in half the time (2 minutes vs. 4 minutes) of other indirect adhesives,1 while achieving two thirds of its bond strength within the first five minutes.1

 

Designed to complement our APC™ Adhesive Coated Appliances, the Sondhi rapid-set indirect bonding adhesive provides the benefits of indirect bonding. More accurate bracket placement; less bracket repositioning; maximisation of orthodontists time; and compared to direct bonding, decreased chair time and patient discomfort from simultaneous bonding of all brackets.

Designed to complement our APC™ Adhesive Coated Appliances, the Sondhi rapid-set indirect bonding adhesive allows you to take full advantage of the benefits of indirect bonding with more accurate bracket placement.

With better control over bracket placement and a high level of precision, accuracy and strength, Sondhi Rapid-Set Indirect Bonding Adhesive aims to deliver an efficient experience, for the orthodontist and the patient.

References

  1. 3M Unitek data on file, 3M Unitek Claim DB Centre “Sondhi (TM) Pre-Mix Chemical Cure Adhesive when used at room temperature of 74 degrees F (23 degrees C) sets in 80-120 seconds.”, Claim Number: 2010 - S10413



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